General Kit Information 66 FR-4 (Standard) Epoxy-glass FR-4 is standard for most kits. Most Boards are double sided. Tg = 140˚C. FR4 (High Temp) High Temp (Tg = 170˚C ~ 180˚C) is used for Lead Free boards. Polyimide (Optional) For high temperatures during assembly or burnin. Polymide Tg is 270˚C. BT (Optional) Bismaleimide Triazine available special order. Copper Thicknes Usually 1.0 oz. of copper. Hot Air Solder Leveling (Sn63) Hot air solder leveling (HASL) during board fabrication gives boards a controlled plating flatness which assures coplanarity for fine pitch components. Liquid Photo Imageable Solder Mask Liquid photoimageable (LPI) soldermask with Sanwa Chemical SPSR-950. Taiyo PSR4000 AUS5 is available special order. X,Y Theta: (Accesory) Component placement data for pick and place machines. Free download. Gerber Data: (Accesory) For solder paste stencil. Free download. Lead-Free (Optional) Available in 4 finishes: Sn100 - Immersion (White) Tin Au (ENIG) Ni - Immersion Gold Ag - Immersion Silver OSP - ENTEK 106 Copper Global Fiducials A minimum of two global fiducials are located diagonally opposed as far apart as possible. Local Fiducials Used to locate the position of an individual. General Kits are supplied with enough components for one side of the board only. OSP (Optional) Organic Solder Preservative over bare copper such as ENTEK106 is available special order. RoHS Banned Substances RoHS Pb-Free Maximum Limit Substance (ppm ) Cadmium (Cd) 100 Lead (Pb) 1000 Mercury (Hg) 1000 Hexavalent Chromium (Cr 6+) 1000 Polybrominated Biphenyls (PBB) 1000 Polybrominated Diphenyl Ethers (PBDE) 1000 About RoHS: The European Union has adopted Directive 2002/95/EC – the Restriction of Hazardous Substances (RoHS) in electrical and electronic equipment. This legislation bans the use of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) in electrical and electronic devices after July 1, 2006 with certain exemptions.
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